When reliability is critical, offshore fabrication houses introduce unacceptable timeline and quality risks into your hardware development cycle. IC Breakout specializes in domestic Surface Mount Technology (SMT) and through-hole PCB assembly, executing highly complex layouts entirely out of our USA-based facility.
Our SMT line is architected around state-of-the-art industrial hardware. We ingest native Altium Designer packages and rapidly move them to our Mycronic MY700 dual-head jet printer. By completely eliminating physical stencils, we cut days out of the prototypical EVT timeline while ensuring perfect paste volume control. For component placement, our MYPro A40 pick-and-place handles extreme high-mix geometries, managing heavily dense BGAs and ultra-fine passives with optical precision.
Thermal stress destroys complex boards. To ensure absolute reliability on high-mass/high-density boards, we cure our runs using Asscon Vapor Phase Reflow technology. Vapor phase curing guarantees absolute thermal uniformity across the entire PCB, eliminating the risk of overheating sensitive silicon or scorching mixed-technology boards.
Core Capabilities & Benefits
Stencil-Free Jet Printing (MY700)
Direct solder paste jetting eliminates stencil fabrication timelines, allowing for same-day layout revisions and perfect volume control.
Complex Placement (MYPro A40)
Optical-alignment tracking guarantees flawless component placement for tightly packed QFNs, bottom-terminated chips (BTC), and dense BGAs.
Vapor Phase Reflow (Asscon)
Advanced physical vapor curing provides zero-delta thermal profiles. Impossible to overheat, eliminating warped boards or burnt connectors.
Seamless Altium Ingestion
We natively process Altium ECAD documentation, collapsing DFM review times and maintaining data parity from schematic to SMT floor.
In Production: Case Scenario
Rapid EVT Iteration
A client required 5 prototype boards loaded with 0201 passives and dual BGAs within 72 hours. By bypassing stencil fabrication with the MY700, we assembled and delivered the EVT run natively, allowing their firm to hit investor demos on time.
Standard Engineering Process
ECAD & DFM Review
Our engineers pull your Altium packages or standard Gerbers/Centroids, performing an immediate design-for-manufacturing analysis.
MY700 Paste Jetting
Boards enter the MY700 where paste and adhesive are dynamically jet-printed, actively bypassing traditional stencil tooling delays.
A40 Optical Placement
Active components are loaded into the MYPro A40, which visually inspects and precisely mounts components at high speed.
Asscon Curing & Delivery
Boards are thermally locked in the Vapor Phase reflow oven ensuring perfect metallurgical joints, visually inspected, and shipped.