SOIC-20 Breakout Board (7.5 x 12.8 mm, 1.27 mm)
This is a breakout board that was designed to be a DIP adapter for the SOIC-20 type SMD packages. Some of the SMD types that can be used with this board include: MSOP, TSSOP, Mini SOIC, Micro SOIC, SOIC-W, SOLIC.
Technical Details
Footprint Dimensions |
|
|
Body (mm): |
7.5 x 12.8 |
|
Pitch (mm): |
1.27 |
|
Thermal Pad (mm): |
n/a |
Breakout Board Dimensions |
|
|
Board Dimensions (mil): |
480 x 1480 |
|
Board Thickness (mil): |
62 |
|
Through-Hole Spacing (mil): |
300 mil (X-axis) |
|
100 mil (Y-axis) |
|
Breakout Board Specifications |
|
|
Board Layers: |
2 |
|
Finish: |
Immersion Gold |
|
Copper: |
1 oz |
|
Traces (mil) |
10 |
|
Trace Lengths (mil): |
<600 |
|
Pin/Through-Hole Count: |
20 |
What's Included?
|
Parts Installed on Board: |
None |
|
Parts Included (but not installed): |
20 PIN Break Away Header (Straight) |
Additional Features
- Easily identifiable PIN 1 indicator and PIN numbers
- White silk “Label Pads” allow you to label the pins for quick reference
- Extended through-hole pads make for an easy connection point for surface mount parts
- Breadboard friendly pin spacing
- All boards have been E-tested for failures and are RoHS compliant
…More details on our additional features can be found HERE
Documentation
(includes a 1:1 Scale Image of the board to ensure that it will be a good fit for your project!)
- Reviews
This section doesn’t currently include any content. Add content to this section using the sidebar.