SOIC-16 Breakout Board (3.9 x 9.9 mm, 1.27 mm)
This is a breakout board that was designed to be a DIP adapter for the SOIC-16 type SMD packages. Some of the SMD types that can be used with this board include: VSO, XSON, HVSON, HWSON, HXSON.
Technical Details
Footprint Dimensions |
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Body (mm): |
3.9 x 9.9 |
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Pitch (mm): |
1.27 |
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Thermal Pad (mm): |
n/a |
Breakout Board Dimensions |
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Board Dimensions (mil): |
450 x 1180 |
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Board Thickness (mil): |
62 |
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Through-Hole Spacing (mil): |
300 mil (X-axis) |
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100 mil (Y-axis) |
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Breakout Board Specifications |
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Board Layers: |
2 |
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Finish: |
Immersion Gold |
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Copper: |
1 oz |
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Traces (mil) |
10 |
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Trace Lengths (mil): |
<500 |
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Pin/Through-Hole Count: |
16 |
What's Included?
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Parts Installed on Board: |
None |
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Parts Included (but not installed): |
16 PIN Break Away Header (Straight) |
Additional Features
- Easily identifiable PIN 1 indicator and PIN numbers
- White silk “Label Pads” allow you to label the pins for quick reference
- Extended through-hole pads make for an easy connection point for surface mount parts
- Breadboard friendly pin spacing
- All boards have been E-tested for failures and are RoHS compliant
…More details on our additional features can be found HERE
Documentation
(includes a 1:1 Scale Image of the board to ensure that it will be a good fit for your project!)
- Reviews
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