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SOIC-14 Breakout Board (3.9 x 8.65 mm, 1.27 mm)

ICB00465

SOIC-14 Breakout Board (3.9 x 8.65 mm, 1.27 mm)

$3.95 USD

In Stock

Technical Overview

This is a breakout board that was designed to be a DIP adapter for the SOIC-14 type SMD packages. Some of the SMD types that can be used with this board include: MSOP, TSSOP, Mini SOIC, Micro SOIC, SOIC-W, SOLIC.

Technical Details

Footprint Dimensions

Body (mm):

3.9 x 8.65

Pitch (mm):

1.27

Thermal Pad (mm):

n/a

Breakout Board Dimensions

Board Dimensions (mil):

420 x 1080

Board Thickness (mil):

62

Through-Hole Spacing (mil):

300 mil (X-axis)

100 mil (Y-axis)
Breakout Board Specifications

Board Layers:

2

Finish:

Immersion Gold

Copper:

1 oz

Traces (mil)

10

Trace Lengths (mil):

<800

Pin/Through-Hole Count:

14

What's Included?

Parts Installed on Board:

None

Parts Included

(but not installed):

14 PIN Break Away Header (Straight)

Additional Features

    • Easily identifiable PIN 1 indicator and PIN numbers
    • White silk “Label Pads” allow you to label the pins for quick reference
    • Extended through-hole pads make for an easy connection point for surface mount parts
    • Breadboard friendly pin spacing
    • All boards have been E-tested for failures and are RoHS compliant
…More details on our additional features can be found HERE

Documentation

(includes a 1:1 Scale Image of the board to ensure that it will be a good fit for your project!)

Manufacturing Support

Need Custom Manufacturing for SOIC-14 Breakout Board (3.9 x 8.65 mm, 1.27 mm)?

Whether you need low-volume prototyping or full-turnkey scaling for components like the SOIC-14 Breakout Board (3.9 x 8.65 mm, 1.27 mm), IC Breakout provides reliable Contract Electronics Manufacturing out of our Reno, NV facility. Stop worrying about component sourcing and factory defects.

Reno Electronics ManufacturingUSA PCB Assembly